Premium Hand-Finished Blades: Each blade is meticulously hand-polished by experienced technicians, resulting in ultra-sharp edges that facilitate precise cutting and scraping without damaging sensitive components.
Ergonomic Alloy Handle: The handle undergoes a special sandblasting process, producing a fine texture with a frosted effect. Anodic oxidation treatment adds a colored oxide layer, enhancing grip and corrosion resistance.
Versatile Blade Models:
Model S: Designed to separate the CPU and NAND flash.
Model E: Ideal for removing glue from mobile phone motherboard ICs and CPUs.
Model X: Specialized for professional edge glue removal.
Model Y: Crafted to cut underfill black glue without harming the motherboard
