Supports Exynos 2100, 1080, 9815, 9609, 8895-1703 + RAM | Precision Mesh for Samsung Galaxy Rework

AMAOE EU5 stencil is a high-precision BGA reballing tool tailored for advanced chip-level repair on newer Samsung Exynos CPUs and RAM ICs. Featuring a 0.12mm thick stainless steel build, this stencil is compatible with high-performance SoCs such as Exynos 2100, 1080, 9815, and others commonly found in the Galaxy S21, S20 FE, M52, A72, A52s, and similar models. This stencil includes both CPU and RAM slot meshes, offering full support for dual-layer rework involving IC removal, cleaning, and reballing. It also features a pattern for SAMSUNG 3830 XGO and Exynos 8895-1703, expanding compatibility for mid-range models and development boards.

The laser-cut half-etched mesh provides reliable pad alignment and resistance to thermal deformation, making it suitable for hot air, infrared, and BGA soldering stations. EU5 is an essential stencil for rework technicians focused on newer-generation Samsung smartphone motherboards.