High-Precision IC Reballing Tool for Samsung Exynos E8845 Chipsets-0.12mm Precision BGA Template

AMAOE Exynos1480 E8845 Stencil is a precision-engineered reballing template designed specifically for Samsung Exynos 1480 series chipsets, including the E8845 CPU. With a thickness of 0.12mm, this stencil is built for professional-grade reballing, ensuring accurate solder paste placement and thermal stability during IC chip rework and BGA repairs.

Crafted with anti-warp technology and strong magnetic base support, it minimizes displacement during soldering. Ideal for technicians working on modern Samsung mobile platforms and high-performance logic boards.