The AMAOE QU7 is a professional-grade BGA reballing stencil made for Snapdragon 400, 600, and 700 series processors, particularly the popular SM-series platforms like SM4250 (SD460), SM6115 (SD662), SM6125 (SD665), SM7150 (SD730G), SM7225 (SD750G), SM7250 (SD765G), and SM7350 (SD775G). Crafted from 0.12mm superhard stainless steel, this stencil features high-precision laser-cut holes and a half-etched anti-warp design. It’s ideal for use in chip-level repair labs across Nepal working on devices from Xiaomi, Samsung, Vivo, Realme, Nokia, Motorola, Oppo, and other major brands.