Middle Layer Reballing Platform for Galaxy S23 Ultra SM-S918U/O/W/D – Precision Stencil with Magnetic Base Fixture

AMAOE S23 Ultra SM-S918U BGA Platform is a professional-grade soldering and reballing solution designed for middle-layer motherboard repair on Samsung Galaxy S23 Ultra series devices. This kit enables clean and precise CPU, RAM, and SoC reballing with a specially designed stencil for the SM-S918U motherboard structure. Built for multilayer board architecture, this set includes a 0.12mm laser-etched stainless steel stencil, a durable positioning plate, and a magnetic fixture base that ensures complete stability throughout the reballing process. The heat-resistant design and fine mesh allow clean tin planting with minimal splash—perfect for professionals performing IC-level rework and BGA soldering.