1.            Versatile 360° rotating buckle type fixture for mobile phone motherboard repair and maintenance.

2.             Multi-functional clamping capabilities, including motherboard welding, chip deglue, and board removal maintenance.

3.            High temperature resistance to withstand the demands of various repair tasks.

4.          Meet the needs of different maintenance tasks, providing reliable support for precise and efficient mobile phone motherboard repairs.

5.           Compatible with Xiaomi Redmi 8, Redmi 8A, Redmi Note 8, and Redmi Note 8T models.

6.           Bottom plate is made from durable alloy steel, offering resistance to high temperatures and corrosion.

7.         Two-way precise clamping system, including precise card slots and step sliders, ensures secure and accurate positioning of the motherboard.