Specialized for Mid-Layer Glue Removal and RAM Reballing | For Galaxy S9, S8, A8+, A7, A50 Series

AMAOE EU4 stencil is a specialized 0.15mm mid-layer stencil designed for Samsung Exynos RAM IC reballing and mid-layer glue removal tasks. Engineered from superhard stainless steel, this stencil offers wider thermal tolerance, making it ideal for heating, scraping, and reballing work on RAM ICs paired with popular Exynos SoCs.

EU4 supports RAM reballing for chipsets such as Exynos 8890, 7884/7885/7904, 7870/7880, 9610/9611, and 5430 – commonly found in Galaxy S, A, and M series smartphones. Its square mesh design supports efficient heat transfer, while the laser-cut half-etched layout ensures clean solder pad alignment during RAM replacement or rework. Perfect for reballing technicians and advanced mobile repair professionals in Samsung CPU mid-layer lamination or RAM-only replacements, this stencil also supports glue removal due to its thicker steel frame (0.15mm).