Remove the IP-X motherboard layered, we use 185-degree layered process, not only From our fine analysis of IP-X solder paste ,but also depends on the special heating design and precise temperature control of SS-T12A.

Only heating the area that the IP-X board needs to be removed to prevent improper heating.

Dual bayonet design ,make sure the IP-X motherboard is stable on the stage.

High purity copper is used as a film to ensure uniform heat transfer and heat.