RELIFE RL-601MA is a professional CPU tin planting platform set designed specifically for iPhone A8 to A18 chipsets. This set features a universal chip slot structure with precision alignment, ensuring efficient and secure CPU reballing and repair. Made with durable high-temperature resistant materials, the RL-601MA platform integrates multiple functionalities—positioning, glue removal, and tin planting—all in one compact design. The included stainless steel stencils (RL-044 Series) support accurate solder ball application, making it ideal for technicians performing logic board or chip-level repairs. Whether you're handling IC refurbishment or BGA reballing, this set offers reliability, speed, and superior accuracy for professional iPhone CPU repair.

Perfect For: Mobile technicians and chip-level repair expert, iPhone A-series CPU reballing, Logic board IC maintenance, Professional mobile repair labs