Professional-Grade Rework Balls for iPhone & Android Solder Pad Repair

2UUL PadBall Series (PB01 & PB02) is engineered for precision solder pad rework during IC, BGA, or pad-level repairs. Whether you're restoring iPhone or Android motherboards, these high-quality Sn63/Pb37 solder balls offer uniform size, strong adhesion, and reliable conductivity—perfect for clean, professional results every time.

Available Variants:

• PB01 (White Cap) – For iPhone Solder Pad Rework
• PB02 (Black Cap) – For Android Solder Pad Rework