SDM845 / Exynos9810 CPU Reballing Stencil for Samsung S9 & S9+ Series – 0.12MM

AMAOE SAM7 stencil is engineered for high-precision reballing of Qualcomm SDM845 (Snapdragon 845) and Samsung Exynos 9810 processors. Specially tailored for Samsung flagship phones like the Galaxy S9 and S9+, this stencil is an essential tool for chip-level mobile motherboard repair technicians.

Made from durable 0.12MM stainless steel, the SAM7 features semi-etched shielding zones, minimizing solder overflow and ensuring accurate ball placement. Whether you're repairing logic boards or replacing a CPU, this stencil gives you the reliability and precision needed in advanced IC rework.