AMAOE BGA Platform for Samsung S22 SM-S906/901U – Back Side Middle Layer Reballing Kit (0.12mm Stencil)

AMAOE Planting Tin Platform – S22 SM-S901U Back Side Middle Layer is a precision BGA reballing solution crafted for advanced motherboard repair on Samsung Galaxy S22 (SM-S901U/S901U1/S906U) models. This kit is specifically designed for reballing and tin planting on the reverse side of the middle-layer PCB, where CPU, RAM, and SoC are located.

The platform includes a 0.12mm high-precision etched stencil, a dedicated magnetic base fixture, and a custom positioning plate, allowing for accurate alignment and stable rework. Ideal for professionals handling multilayer chip-level repairs, this tool ensures low-splash tin planting, heat resistance, and clean solder ball positioning on complex logic boards.

Purchase Options:

• Stencil Only (S906/901U 0.12mm Mesh): NRS 350

• Stencil + Positioning Plate: NRS 1600

• Complete Kit (Stencil + Plate + Magnetic Fixture): NRS 3000