Multi-Size, Multi-Pitch Versatile Reballing Net

AMAOE Universal BGA Stencil is an essential tool for mobile motherboard repair technicians. Specially designed to support multiple IC sizes and pitch distances, this high-precision stencil offers excellent durability, compatibility, and reusability. Whether you're working on 0.3mm, 0.35mm, 0.4mm, or 0.5mm pitch chips, this single stencil covers it all – making it a must-have for any reballing workspace.

If you're a mobile repair professional, you know the frustration of not finding the right stencil during IC replacement. The AMAOE Universal Reballing Stencil eliminates that problem by offering one stencil to handle dozens of chip sizes. It's compact, high-quality, and reliable – just what every technician needs on their bench.