Comprehensive Power Management Stencil for PM8000 Series and Beyond

AMAOE PM1 Reballing Stencil is designed specifically for Qualcomm PMIC (Power Management Integrated Circuit) chipsets, essential components in mobile phone logic boards that regulate power delivery and battery management. Crafted from high-precision 0.12mm stainless steel, this stencil supports more than 20 Qualcomm PM IC models used in smartphones from Samsung, Xiaomi, Vivo, Oppo, Realme, OnePlus, Huawei, and other major Android brands.

Whether you're replacing a shorted power IC or reballing a BGA package for reinstallation, the PM1 mesh ensures clean solder ball alignment, no bridging, and consistent heating, making it an essential tool for professional chip-level repair technicians.