Stencil-S21+SM-G996U/0/D/W middle layer

-AMAOE 0.12mm Middle Layer Stencil for Samsung S21+ SM-G996U/O/D/W 

AMAOE S21+ SM-G996U Stencil is a professional-grade middle-layer reballing mesh specifically designed for Samsung Galaxy S21 Plus motherboard (SM-G996U/O/D/W variants). This high-precision stencil is crafted from durable 0.12mm stainless steel, ideal for tin planting during CPU, RAM, and SoC repairs on the internal logic board. Whether you are reballing multilayer ICs or replacing components on the second-layer board, this stencil offers perfect alignment and minimal solder splash, ensuring reliable and repeatable results for chip-level technicians.

It is part of AMAOE’s model-specific BGA platform series and can be paired with a positioning plate and magnetic base (sold separately) for full reballing workflow.