AMAOE U-QSU Series (U-QSU1 to U-QSU6) is a premium line of Qualcomm CPU BGA Reballing Stencils designed for high-precision motherboard repair and IC tin planting. Manufactured from 0.12mm ultra-thin stainless steel, these stencils feature anti-warping ventilation holes and UBGA positioning for accurate, consistent results. Each stencil supports multiple Qualcomm Snapdragon chipsets and RAM configurations, making this collection a versatile and essential tool for professional repair technicians across Nepal.

Precise BGA hole alignment
0.12mm ultra-thin stainless steel
Supports a wide range of Qualcomm chipsets
Ideal for motherboard IC rework & RAM reballing
Professional-grade reliability for daily technician use