Advanced Tin Planting Platform for Samsung S24 Ultra SM-S928U – For Reverse Side Middle Layer Logic Board Rework

AMAOE S24 Ultra SM-S928U BGA Platform is a specialized middle-layer soldering and reballing solution tailored for the latest Samsung Galaxy S24 Ultra logic board structure. Designed for reverse-layer CPU, RAM, and PMIC repair, this kit delivers professional-grade precision and stability for chip-level motherboard rework.

The platform includes:

• A 0.12mm high-precision laser-etched stencil for accurate solder ball alignment
• A positioning plate that perfectly matches the S928U middle-layer board design
• A powerful magnetic base fixture to lock components during soldering

Whether you're replacing SoC or repairing memory ICs on the back side of the PCB, this system ensures a stable, splash-free, and thermally resistant reballing process. Ideal for repair labs and skilled technicians handling Samsung S24 Ultra multilayer motherboard repairs.