For S21/S21+/S21 Ultra, Z Flip3/Fold3/W22 | SM8350/Exynos2100 CPU Reballing Stencil

-Universal Stencil for Snapdragon 888, Exynos 2100 & Flagship Samsung Chipsets | 0.12MM Superhard Steel

AMAOE SAM15 is a high-precision reballing stencil designed for flagship Samsung smartphones including the S21, S21+, S21 Ultra, Galaxy Z Flip3, Z Fold3, and W22. Engineered for Snapdragon 888 (SM8350) and Exynos 2100 platforms, this stencil ensures optimal IC alignment and solder ball replanting accuracy. Made from durable 0.12MM Japanese stainless steel, it features semi-etched shielding for minimal solder overflow and exceptional reusability. The stencil also supports PM, WiFi, and RAM chips commonly found in Samsung’s top-tier models like PM8350, QPMS5825, W9020, SDR868, and more.

This is the go-to tool for advanced motherboard-level technicians handling complex reballing tasks on Samsung flagship series. Whether for professional chip repair labs or premium-level repair shops in Nepal, the SAM15 delivers performance and affordability in one.