AMAOE MU6 – MTK CPU BGA Reballing Stencil

Delivery Time

AMAOE MU6 stencil is a top-tier solution for reballing MediaTek’s latest flagship and mid-tier Dimensity & Helio CPUs. It supports CPUs like Dimensity 9300 (MT6989W), 9200 (MT6985W), 8300 Ultra (MT6897Z), 7200 Ultra (MT6886V), Dimensity 7300X (MT6878V), Helio G96 (MT6781V), and MT6835V (Dimensity 6100+). Also includes support for BGA496 universal RAM layout. Manufactured using 0.12mm ultra-hard stainless steel, the MU6 stencil features a half-etched, anti-warp design for precise solder ball placement and efficient thermal performance—perfect for chip-level repair engineers working on the latest smartphones and tablets.

This stencil is suitable for repairing advanced MTK-based devices from Vivo, Xiaomi, Realme, Infinix, Tecno, Oppo, Honor, POCO, ZTE, Motorola, and more. If you're servicing Dimensity-powered 5G phones from 2022–2024, MU6 is your go-to stencil.

Price

रु 350

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