Upgrade your hot air rework setup with the Universal Bent Nozzle JABE Set, designed specifically for mobile phone motherboard repair, soldering, and desoldering ICs under a microscope. This complete kit includes three 45° angled nozzles of different diameters along with precision JABE blades that help shield surrounding components during heat application.

These nozzles are compatible with most standard hot air stations like QUICK 861DW, SUGON 8620DX, LUOWEI, and more. The angled airflow enhances visibility and control, allowing pinpoint heating in dense circuit zones. Ideal for chip-level technicians, BGA work, and delicate IC replacements.