AMAOE Planting Tin Platform for Samsung S21 SM-G991U / G9910 / G991W / G991D

– Middle Layer BGA Reballing Fixture (0.12mm)

AMAOE Planting Tin Platform – S21 SM-G991U is a specialized BGA reballing tool designed for middle-layer soldering on the Samsung Galaxy S21 mainboard. Engineered with precision for SM-G991U / G9910 / G991W / G991D models, this reballing platform provides a complete solution for accurate and efficient CPU + RAM IC reballing on multilayer PCBs. The stencil is made with 0.12mm high-precision etched mesh, designed specifically for S21 motherboard structure, ensuring consistent solder ball alignment and minimal splash. The dedicated magnetic base fixture and custom positioning plate offer superior stability and alignment during the reballing process.

This tool is ideal for professional chip-level technicians handling Samsung logic board repairs and replacements involving underfill and middle-layer ICs.

Purchase Options:

• Stencil Only (0.12mm mesh for SM-G991U)

• Stencil + Positioning Plate

• Stencil + Plate + Magnetic Base Fixture (Full Kit)

Choose the configuration that suits your lab setup — available for both individual use and professional workstations.