AMAOE EU2 Samsung Exynos CPU BGA Reballing Stencil

Delivery Time

Supports Exynos 9810, 8895, 7580, 7570, 3470, 3475 | For Samsung Galaxy A, J, S Series Chipsets

AMAOE EU2 stencil is crafted for Samsung Exynos chipsets, covering a range of processors found in both flagship and budget smartphones. Made from 0.12mm ultra-hard stainless steel, the stencil ensures thermal stability and resistance against warping during hot air or IR soldering. EU2 supports Exynos 9810 (Galaxy S9/S9+), 8895 (Galaxy S8/S8+), 7580/7570 (Galaxy J5/J7, A3/A5), and 3470/3475 (Galaxy Core Prime/Grand Prime). It includes support for A and B variants, offering technicians a reliable tool for IC reballing on several generations of Samsung Galaxy smartphones. 

Ideal for chip-level repairs in Nepal’s service centers and mobile labs, this stencil ensures clean solder ball alignment and is compatible with phones from Samsung, Meizu, and some mid-range brands using Exynos chipsets.

Price

रु 350

Qnt