For New-Generation UNISOC Chipsets – Ideal for Itel, Lava, Tecno, Symphony & More

AMAOE SU3 BGA Reballing Stencil is expertly crafted for reballing the newer generation Spreadtrum/UNISOC chipsets, especially SC9832E and SC9863A, widely used in today’s budget and mid-range Android smartphones. Engineered with 0.12mm ultra-precise stainless steel, this stencil delivers stable solder alignment for CPU, baseband, and memory rework. Additional cutouts like BGA254, RPM6743-31, SC2721G, SR3595D, and RTM7916-51 offer support for related power management and companion ICs. This makes the SU3 stencil extremely versatile for full chipset servicing, especially in Android Go devices and 4G smartphones from brands like Itel, Lava, Tecno, Infinix, Symphony, and more.

Perfect for professional rework labs and mobile repair shops, the SU3 ensures clean ball placement, no warping, and long-lasting durability during repeated hot air usage.