Supports SC7731, SC9832A, SC7730A, SC6825, SC6825A & More | Ideal for Entry-Level Smartphone CPU Repair

AMAOE SU1 BGA Reballing Stencil is a specialized 0.12mm laser-cut steel stencil designed for Spreadtrum/UNISOC CPU chipsets, widely used in entry-level Android smartphones, feature phones, tablets, and IoT devices. With precision-cut layouts for common SC-series chipsets like SC7731G, SC9832A, SC7730A, SC6825C, SC6825A, and more, this stencil ensures perfect solder alignment during CPU reballing or chip replacement processes. It’s especially useful for brands like Itel, Lava, Micromax, Symphony, Karbonn, Tecno, Infinix, and other budget segment smartphones sold across Nepal and South Asia.

Built using superhard stainless steel, this stencil resists heat warping and is designed for long-term reusability under repeated hot air or IR rework conditions.