Supports Snapdragon 8 Gen2 (SM8550), 7+ Gen2 (SM7475), Dimensity 9000 (MT6983Z), MT8176V, MT6895Z, and RAM496

AMAOE MQ5 stencil is a premium dual-platform BGA mesh for reballing both Qualcomm Snapdragon and MediaTek Dimensity CPUs, along with corresponding RAM ICs. It is ideal for high-precision rework of modern flagship chipsets, using a finely laser-cut mesh on 0.12mm superhard stainless steel. This stencil supports Snapdragon SM8550 (8 Gen2), SM8475 (8+ Gen1), SM7450 (7 Gen1), SM6225 (Snapdragon 680) and MediaTek chipsets like MT6983Z (Dimensity 9000), MT6895Z/8795Z (Dimensity 8100/8200), MT8176V (tablet SoC). Additionally, it includes a universal RAM496 mesh and RAM stencils for SM8550 and MT6895Z.

With its half-etched design, it prevents distortion during soldering, ensuring optimal alignment and solder ball placement. Perfect for chip-level technicians working on phones and tablets from Xiaomi, OnePlus, Vivo, Oppo, Samsung, Honor, Realme, iQOO, Infinix, Tecno, Lenovo, and more.