AMAOE QU9 is the most advanced stencil in the QU Series, supporting Snapdragon 7 and 8 Gen1/Gen2/Gen3 CPUs, including chipsets like SM8450 (Snapdragon 8 Gen1), SM8550 (8 Gen2), SM8650 (8 Gen3), SM8350 (8s Gen3), SM8750 (8s Gen3 Elite), SM7475 (7+ Gen2), SM7550 (7 Gen3) and BGA496 layouts. Built from 0.12mm superhard stainless steel, the QU:9 stencil features half-etched structure and high-precision openings for accurate solder ball reflow. It’s designed for chip-level engineers working on premium and flagship-level smartphones, ensuring compatibility with new-generation devices from Samsung, Xiaomi, Vivo, Realme, OnePlus, iQOO, Oppo, Honor, Motorola, Nubia, ZTE, Asus, and more. This stencil is essential for reballing CPU and RAM ICs on the most recent high-performance Android phones powered by Snapdragon 8 Gen-series chipsets, widely used in 5G-enabled mobile devices from 2022 to 2024.