iPhone Middle Layer Steel Mesh Reballing Stencil with Magnetic Mold Set

MIJING Z20 Pro X-15 Series is the ultimate reballing solution for iPhone motherboard repair technicians. Designed for precision BGA chip tin planting, this professional-grade set includes the full X-15 series middle-layer stainless steel stencils, covering iPhone X to iPhone 15 Pro Max, along with matching insertion positioning modules (moulds) and a universal magnetic base.

Whether you’re handling Face ID, CPU, NAND, or baseband work, this set ensures high efficiency, alignment accuracy, and zero damage during IC reballing operations.