MSM8916 / MSM8953 B01-AB CPU Universal Reballing Stencil (0.12MM) for Samsung C7, J3, J5, A5 Series

AMAOE SAM6 stencil is a high-quality reballing mesh built for Samsung smartphones using Qualcomm MSM8916 and MSM8953 B01-AB CPUs. It’s specifically compatible with models such as Samsung C7010, J610, and devices in the C7, J3, J5, and A5 series.

Fabricated from precision-engineered 0.12MM ultra-thin stainless steel, this stencil features a semi-etched anti-overflow tin design, enabling clean and accurate BGA reballing for IC replacement or CPU repair. SAM6 is ideal for technicians looking for efficiency, durability, and compatibility across multiple Samsung models.