AMAOE BGA Planting Tin Platform for Samsung S21 Ultra SM-G998U/O/D/W – Middle Layer Reballing Kit (0.12mm)

AMAOE Planting Tin Platform – SM-G998U is a specialized middle-layer BGA reballing solution tailored for Samsung Galaxy S21 Ultra motherboard repair. This high-precision kit includes a 0.12mm laser-etched stencil, a dedicated positioning plate, and a powerful magnetic base fixture, allowing chip-level technicians to rebalance, reball, or replace multilayer CPU, RAM, and SoC components with confidence and accuracy.Optimized for Samsung SM-G998U, G998O, G998D, and G998W variants, this reballing platform offers reliable alignment, clean tin planting, and minimal solder splash—ideal for both professional mobile repair labs and advanced technicians.

Purchase Options:

• Stencil Only (0.12mm mesh for SM-G998U Middle Layer): NRs 350
• Stencil + Positioning Plate: NRs 1600
• Stencil + Plate + Magnetic Base Fixture (Full Kit): NRs 3000