MSM8976 CPU Universal Series – 0.12MM Reballing Stencil for Samsung A and C Series

AMAOE SAM5 Stencil is a high-precision reballing mesh engineered for Samsung smartphones powered by the Qualcomm MSM8976 CPU. Designed for advanced BGA chip rework and tin planting, it provides the perfect fit for Samsung A9 and C9 Series devices, including models like Galaxy A9000, A9100, and C9000.

Crafted from super-hard 0.12MM stainless steel, this stencil features a semi-etched anti-overflow design, ensuring even tin ball distribution and preventing excess soldering. It is ideal for motherboard repair professionals using hot air stations and microscopes for delicate CPU rework.