Professional-Grade Magnetic Repair Pad for CPU/NAND IC BGA Reballing – Ideal for Precision Tin Planting

YCS Tin-Planting Arc Pad is a specialized tool designed for professional mobile phone repair technicians handling delicate tin planting tasks. Built with durable, heat-resistant material, this pad ensures optimal performance during BGA reballing of CPU and NAND IC chips. Its integrated steel mesh provides powerful magnetic adsorption to keep your components securely in place, while dedicated planting tin zones (0.4MM, 0.5MM, and MIRCO) offer structured working space for high-efficiency operations.

This tin-planting pad features a smart arc design with precision-cut holes for better heat dissipation, protecting sensitive components during soldering. Its anti-slip construction ensures stability on the workstation, making it a must-have for repair professionals dealing with high-temperature applications.