Middle Layer Reverse Side Reballing Platform for Galaxy S24 SM-S921U/W/O/D – 0.12mm Precision Stencil with Magnetic Fixture

AMAOE BGA Reballing Platform for Samsung Galaxy S24 SM-S921U is an advanced chip-level repair solution designed for reverse middle-layer reballing on Galaxy S24 motherboards. This platform enables precision solder ball planting on CPU, RAM, and PMIC chips located on the back side of the multilayer logic board.

It includes a 0.12mm stainless steel laser-etched stencil, a custom positioning plate, and a strong magnetic base for stability and alignment during soldering. Engineered specifically for the SM-S921U/W/O/D models, this kit ensures minimal splash, accurate reballing, and consistent results for professional IC technicians and mobile repair labs.