Middle Layer CPU & RAM Reballing Platform for Galaxy S23+ SM-S916U/W & S911 Models – AMAOE Precision Kit with 0.12mm Stencil

AMAOE S23+ SM-S916U/S911 BGA Platform is a high-precision tin planting solution designed specifically for back side middle-layer motherboard repairs on Samsung Galaxy S23+ and related models. This professional tool kit is engineered to support CPU, RAM, and SoC solder reballing on the reverse layer of multilayer logic boards, where dense IC integration demands utmost precision.

This complete platform includes:

• A 0.12mm laser-etched stainless steel stencil, designed for REV07E W44 motherboard layout
• A dedicated positioning plate for flawless chip alignment
• A powerful magnetic fixture base to stabilize the board during reballing

Built for chip-level rework experts, this platform ensures minimal solder splash, precise ball planting, and heat resistance for repeated usage—making it ideal for professional mobile repair labs handling S23+ motherboard logic rework.