Precision Reballing Solution for Samsung S22 Ultra Middle Layer Logic Board – Supports SM-S908U, S908B, S908E, and S908W Models

AMAOE BGA Reballing Platform – S22 Ultra SM-S908U/B Middle Layer is a high-precision tin planting solution designed for chip-level motherboard repair on Samsung Galaxy S22 Ultra devices. This kit is engineered for middle-layer CPU, RAM, and SoC IC reballing, and includes a 0.12mm etched stainless steel stencil, a magnetic base, and a positioning plate for precise alignment and stability.

Specifically compatible with S908U, S908B, S908E, S908W, and S908BE models, the stencil layout ensures minimal solder splash and accurate ball placement for multilayer PCB rework. Built to withstand heat and repeated use, this platform is trusted by professionals for advanced Samsung repairs.

Purchase Options:

• Stencil Only (0.12mm for SM-S908U/B): NRs 350

• Stencil + Positioning Plate: NRs 1600

• Complete Kit (Stencil + Plate + Magnetic Fixture Base): NRs 3900