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Apple ASeries Reballing Stencils (U-APU 3 and U-APU 7)

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Amaoe UBGA CPU Series tin Planting Platform Stencil and Platform Plate with Magnetic Base

-UBGA Series for Apple A-Series CPUs

AMAOE U-APU Series is a specialized line of BGA reballing stencils and platforms designed exclusively for Apple A-Series CPUs and RAM ICs. These stencils cover a wide range of iPhone and iPad chipsets, enabling professional technicians to perform highly precise reballing and IC repairs on Apple logic boards. Each stencil is made with 0.12mm high-precision steel mesh, optimized for CPU/RAM soldering. The UBGA Base-A platform and alignment plates ensure stability, accuracy, and repeatability—making these kits ideal for chip-level iPhone repair professionals.

Available Purchase Options:

  • Stencil Only – for experienced users
  • Stencil + Alignment Plate – for guided placement
  • Full Platform Kit – Stencil + Plate + Base Fixture for maximum efficiency
Price

रु 3000

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