Samsung Exynos CPU & RAM IC Series | 0.12mm UBGA Mesh

AMAOE U-SMU3 is a precision-engineered 0.12mm BGA reballing stencil, purpose-built for Samsung Exynos high-performance CPUs and integrated RAM chips. Designed for flagship-level smartphone repairs, this stencil supports popular SoCs such as Exynos 2100, 9815, 1080, 990, 9820, 9810, 2200/E9925, and RAM ICs like RAM 496 and RAM 556. It’s part of AMAOE’s UBGA series with anti-warp and high-temperature resistant construction, making it ideal for CPU + RAM tin planting, IC reballing, and logic board rework. Whether you're repairing a Galaxy S21 Ultra or Note 20, this stencil ensures tight alignment and minimal solder splash.

Compatible with the UBGA-A magnetic base fixture and optional positioning plate, it gives technicians precision and stability for every BGA task.

Purchase Options:

• Stencil Only (U-SMU1 – 0.12mm): NRs 350
• Stencil + Optional Positioning Plate: NRs 1600
• Stencil+positioning plate+UBGA-A Base Fixture (sold separately): NRs 3000