Samsung Exynos CPU & RAM IC Series | 0.12mm UBGA Mesh

AMAOE U-SMU2 is a premium 0.12mm BGA reballing stencil meticulously designed for chip-level repair of Samsung Exynos CPUs and onboard RAM ICs. Supporting a wide array of processors including Exynos 9610, 9611, 9609, 880, 980, 1280, 850, 7885, 7904, and more, this stencil is ideal for servicing mid to high-end Samsung smartphones. Part of the UBGA expert stencil series, the U-SMU2 is laser-etched for precision and offers excellent heat resistance, minimal solder splash, and strong anti-warping structure. Whether you’re repairing a Galaxy A series or other Exynos-powered device, the U-SMU2 ensures accurate ball alignment for CPUs and RAM.

Fully compatible with the UBGA-A magnetic base fixture and optional positioning plate, it’s a must-have for any technician working on Samsung Exynos logic board repairs.

Purchase Options:

• Stencil Only (U-SMU1 – 0.12mm): NRs 350
• Stencil + Optional Positioning Plate: NRs 1600
• Stencil+positioning plate+UBGA-A Base Fixture (sold separately): NRs 3000