Samsung Exynos CPU Series | 0.12mm UBGA Mesh

AMAOE U-SMU1 is a high-precision 0.12mm BGA reballing stencil developed specifically for Samsung Exynos CPU and RAM IC chipsets. Ideal for chip-level repairs on Samsung smartphones, this stencil supports a wide range of processors including Exynos 8895, 7870, 7880, 7570, 7580, and more. Crafted from premium-grade stainless steel, the stencil features laser-etched holes with excellent heat resistance and anti-warping technology. Whether you're reballing CPUs, RAM, or power ICs, the U-SMU1 ensures accurate and consistent solder ball placement with minimal splash.

Part of AMAOE's UBGA professional series, this stencil is compatible with the UBGA-A magnetic base fixture and can be paired with a positioning plate (sold separately) for enhanced rework precision.

Purchase Options:

• Stencil Only (U-SMU1 – 0.12mm): NRs 350
• Stencil + Optional Positioning Plate: NRs 1600
• Stencil+positioning plate+UBGA-A Base Fixture (sold separately): NRs 3000