Reballing Stencil for UNISOC UMS9620S / UMP9621 / BGA254 and Power IC Series

- Universal 0.12mm BGA Stencil for UNISOC CPU, Power IC & Baseband Repair – AMAOE Superhard UN:3 Series

AMAOE UN:3 BGA Reballing Stencil is a precision-engineered tool for mobile technicians working on UNISOC UMS9620S series chips, combo ICs, and power ICs used in Chinese smartphones and feature phones. Built from high-grade 0.12mm stainless steel under AMAOE’s Superhard Series, this stencil guarantees precision alignment, minimal deformation, and excellent heat resistance.

Supporting a wide range of ICs like UMP9620, UMP9621, RR88920-21A, and layouts such as BGA254, it is an ideal stencil for reballing and tin planting on both CPU and peripheral chips. It’s especially useful for repairing models like the T820, Tianyi S9, and related devices.

Perfect for technicians in Nepal handling UNISOC-powered devices including itel, Lava, Infinix, and more.