Reballing Stencil for UNISOC UMS512T / R818 / BGA221 / BGA154 / BGA254 Series IC
- Universal BGA Reballing Stencil for UNISOC CPU & Power IC – Precision Laser Cut, Ultra-Hard Series
AMAOE UN:1 BGA Reballing Stencil is specially engineered for UNISOC chipset repairs, ideal for technicians working on mobile phones powered by UMS512T and related ICs. Crafted from ultra-durable stainless steel with 0.12mm thickness, this precision stencil delivers high-performance results for IC reballing, tin planting, and logic board repair.
Whether you're reballing power ICs, CPUs, or combo chips like UMW2651 or UWP51065, this stencil ensures precise alignment and consistent solder flow. Part of AMAOE’s Superhard Series, UN1 is designed for professional-grade repair environments requiring both accuracy and durability.
