AMAOE SAM2 – Exynos8890 / MSM8996 CPU Reballing Stencil (0.12mm)

For Samsung Galaxy S7 Series – G9300, G9350, G9308, G930F & More

AMAOE SAM2 Stencil is an ultra-precise reballing mesh designed for chip-level repair of Samsung Exynos 8890 and Qualcomm MSM8996 (Snapdragon 820) CPUs. Crafted from 0.12mm high-grade stainless steel, this stencil is purpose-built for motherboard reballing and IC replacement in Samsung Galaxy S7 series devices, including international and regional models such as G9300, G9350, G9308, and G930F.This professional-grade stencil features a semi-etched (half-cut) design, allowing accurate solder ball formation and reducing excess tin during hot air or infrared BGA rework. Whether working with Exynos or Snapdragon platforms, SAM2 offers an ideal solution for dead CPU repair, power issues, IC desoldering, or solder paste applications.