SM8550 / SM8650 / 8Gen2 / 8Gen3 CPU Reballing Stencil for Galaxy S23/S24 Series

AMAOE SAM19 is a high-precision BGA reballing stencil specifically crafted for the latest Qualcomm Snapdragon 8 Gen 2 (SM8550) and 8 Gen 3 (SM8650) chipsets used in Samsung Galaxy S23, S23 Ultra, S24, and S24 Ultra series. Designed for mobile phone motherboard repairs, this stencil also supports a wide range of supporting power ICs, RAM chips, and PMICs, including PM8550BH, VC7643, QDM4303, QPM6810, and others.

If you're handling modern Samsung flagship repairs, SM8550/8650 reballing, or require tight tolerance stencils for fine-pitch ICs, SAM19 offers unmatched precision and chip compatibility. This stencil is designed with semi-engraved shielding features for easier paste application and protection during soldering.