For Exynos 9820 / Snapdragon 855 (SM8150)

Compatible with Galaxy S10 / S10+ / Note10 Series – 0.12MM Precision BGA Reballing Mesh

AMAOE SAM10 stencil is a high-quality, precision-engineered tool designed for CPU and EMCP reballing of flagship Samsung smartphones. Compatible with Exynos 9820 and Qualcomm Snapdragon 855 (SM8150) chipsets, this stencil supports critical repairs on Samsung Galaxy S10, S10+, and Note10 series, including models like G9730, G975, G977, and N975. Made from ultra-thin 0.12MM stainless steel, the stencil features a semi-etched layout, which ensures accurate tin planting, minimal solder overflow, and reliable CPU reballing. Whether you’re restoring logic boards or performing advanced chip-level maintenance, this mesh delivers professional results with consistency and precision.

Perfect for technicians working on premium models, it offers a secure fit, sharp holes, and excellent durability—ideal for high-end mobile phone motherboard repair in Nepal.