AMAOE SAM1 BGA Reballing Stencil is tailor-made for Samsung devices using Exynos 8895 and Qualcomm MSM8998 chipsets. Built from 0.12mm Japanese steel, this stencil guarantees extreme precision and durability for CPU, memory, and IC chip soldering tasks.
Whether you're reballing or reworking logic boards on Samsung Galaxy S8, S8+, or Note8, this stencil ensures perfect solder ball placement thanks to its semi-etched shielding design. Trusted by professional technicians, the AMAOE SAM1 stencil minimizes rework errors and speeds up your mobile IC repair workflow.
Supports Exynos 8895 and Qualcomm MSM8998 chipsets
Designed for Samsung Galaxy S8, S8+, and Note8
High-precision BGA stencil for CPU, eMMC, and IC reballing
Made of 0.12mm Japanese steel – Durable, heat-resistant
Perfect fit for advanced motherboard repair & rework labs
