The AMAOE QU8 is a high-precision BGA reballing stencil designed for Qualcomm’s flagship Snapdragon 800 series and entry-level Snapdragon 439 CPU platforms. It includes full CPU and RAM IC support for SM8250 (Snapdragon 865), SM8350 (Snapdragon 888), SDM439, and their memory components — offering technicians a complete solution for reballing both processor and RAM chips. Crafted with 0.12mm superhard stainless steel, QU:8 features half-etched architecture, clean thermal relief holes, and is capable of handling large and small die versions (e.g., SM8250-102, SM8250-002). This stencil is especially useful for technicians handling premium smartphones from Samsung, Xiaomi, OnePlus, Oppo, Vivo, Realme, Honor, Motorola, Asus, Huawei, and more.

Whether you’re repairing a Snapdragon 888 flagship or an affordable Snapdragon 439-based device, QU:8 is your go-to tool for precise chip-level reballing across Nepal.