The AMAOE QU6 is a specialized BGA reballing stencil designed for reballing Qualcomm CPUs, modems, and baseband ICs from the MDM, MSM, and QSC series. Widely used in smartphones, tablets, and communication devices, these ICs are critical for CPU processing, network connectivity, and mobile baseband control. This stencil supports multi-chip reballing including processors like MDM9600, MSM7627, QSC6270, MDM9215, and more. It’s the perfect solution for technicians working on older-generation Android smartphones, communication modules, and IoT boards. Crafted from 0.12mm superhard stainless steel, the stencil features laser-etched holes, a half-etched anti-warp design, and is optimized for CPU + baseband chip repair workflows.