The AMAOE QU5 is a professional-grade BGA reballing stencil crafted for Snapdragon 600, 700, and 800 series CPUs and RAMs — including SDM845, SM8150, SDM670, SM6150, SDM710, and MSM8917. These chipsets were widely used in popular Android devices from 2018 to 2021, powering mid-range to flagship smartphones from brands like Samsung, Xiaomi, OnePlus, Vivo, Oppo, Nokia, and more. This stencil is made from 0.12mm superhard stainless steel and features a half-etched anti-warp design with precise thermal vent holes for clean solder ball application. It supports both CPU and RAM reballing, making it a versatile tool for chip-level technicians in Nepal.