The AMAOE QU:4 stencil is a precision BGA reballing stencil made for Qualcomm Snapdragon processors used in many flagship Android smartphones between 2012 and 2016. Compatible with chipsets such as MSM8974, MSM8994, and MSM8960, this stencil allows professional technicians to reball CPUs used in high-performance devices like the Samsung Galaxy Note 3, Sony Xperia Z2, LG G3, OnePlus One, and more. Manufactured with 0.12mm superhard stainless steel, it features a half-etched anti-warp design with thermal hole layout, making it ideal for clean solder ball placement and long-lasting usage. This stencil supports the Snapdragon 800, 801, 805, and 810 series, and is trusted by advanced mobile repair labs across Nepal.