The AMAOE QU:3 BGA reballing stencil is designed for reballing a wide range of Qualcomm Snapdragon CPUs used in Android smartphones from 2012 to 2019. Supporting chipsets such as SDM660, MSM8940, MSM8928, MSM8909, MSM8612, and MSM7225A, this stencil is ideal for mobile repair engineers performing chip-level CPU rework. Made with superhard 0.12mm stainless steel, the stencil features high-precision laser-cut holes and thermal vents for clean solder ball placement. Its half-etched anti-warp design ensures reliability even under repeated heat cycles, making it an essential tool in Nepal’s mobile repair labs and training centers. Common devices supported include Xiaomi Mi A2, Redmi Note 7, Vivo V11 Pro, Oppo F9 Pro, Galaxy J1 (2016), Lumia 550, HTC One A9, and many more.