The AMAOE QU:2 is a precision stainless steel BGA reballing stencil crafted for a wide range of Qualcomm Snapdragon chipsets—from entry-level to high-performance SoCs used between 2014 and 2019. This stencil supports popular CPUs like MSM8953 (Snapdragon 625/626/632), MSM8937 (Snapdragon 430/435), MSM8916 (Snapdragon 410), and MSM8998 (Snapdragon 835). Built with superhard 0.12mm thickness, the stencil ensures accurate solder ball placement during chip-level reballing. It’s a go-to solution for Nepalese repair technicians handling phones from brands like Xiaomi, Samsung, Nokia, Vivo, Oppo, and Motorola.